Profile

G&N offers
Lab-grinders, semi automatic grinders, fully automatic grinders
Backside grinding of SI, SiC, Sapphire, GaN,
Thinning of stacked-, SOI-, SOS-, MEMS-wafers
Diamond multi wire saw
Ultra thin wafer grinding 50 – 20 µm with/without tape

Solar wafer production lines with less breakage
Brick grinding

Exhibit

Grinding machine MPS RC V
easy and fast grinding of silicon wafers up to 8 inch.